Toray Engineering has a complete line of flip chip bonders for a variety of applications, including CSP and other semiconductor packages, as well as optical devices, MEMS, COC and RFID.
RNM Dynamics... TI's Supplier Appreciation Award...Thank you TEXAS Instruments!
PSECE and a SEIPI Member...The main venue where industry and technology come together to a single event combining an exhibit with relevant business conferences and technical symposia.
EMAIL: [email protected]
CONTACT #: +632 842 7545